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UPD78F0765GB-GAH-AX

IC mcu 8bit 60kb flash 64lfqfp

器件类别:半导体    嵌入式处理器和控制器   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

器件标准:  

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器件参数
参数名称
属性值
Datasheets
uPD78F0760-765
Standard Package
1
Category
Integrated Circuits (ICs)
Family
Embedded - Microcontrollers
系列
Packaging
Tray
Core Process
78K/0
Core Size
8-Bi
速度
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
LVD, POR, PWM, WDT
Number of I/O
55
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
RAM Size
3K x 8
Voltage - Supply (Vcc/Vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
封装 / 箱体
Package / Case
64-LQFP
Supplier Device Package
*
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User’s Manual
8
78K0/Kx2-C
User’s Manual: Hardware
8-Bit Single-Chip Microcontrollers
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
www.renesas.com
Rev.2.01
Sep
2011
Notice
1.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
When exporting the products or technology described in this document, you should comply with the applicable export control
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“Standard”:
2.
3.
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12.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
NOTES FOR CMOS DEVICES
(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a
reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL
(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise
from entering the device when the input level is fixed, and also in the transition period when the input level
passes through the area between VIL (MAX) and VIH (MIN).
(2) HANDLING OF UNUSED INPUT PINS: Unconnected CMOS device inputs can be cause of malfunction.
If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc.,
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be
connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling
related to unused pins must be judged separately for each device and according to related specifications
governing the device.
(3) PRECAUTION AGAINST ESD: A strong electric field, when exposed to a MOS device, can cause
destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop
generation of static electricity as much as possible, and quickly dissipate it when it has occurred.
Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended
to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and
transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors should be grounded. The operator should be grounded using a
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be
taken for PW boards with mounted semiconductor devices.
(4) STATUS BEFORE INITIALIZATION: Power-on does not necessarily define the initial status of a MOS
device. Immediately after the power source is turned ON, devices with reset functions have not yet been
initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A
device is not initialized until the reset signal is received. A reset operation must be executed immediately
after power-on for devices with reset functions.
(5) POWER ON/OFF SEQUENCE: In the case of a device that uses different power supplies for the internal
operation and external interface, as a rule, switch on the external power supply after switching on the internal
power supply. When switching the power supply off, as a rule, switch off the external power supply and then
the internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements
due to the passage of an abnormal current. The correct power on/off sequence must be judged separately
for each device and according to related specifications governing the device.
(6) INPUT OF SIGNAL DURING POWER OFF STATE : Do not input signals or an I/O pull-up power supply
while the device is not powered. The current injection that results from input of such a signal or I/O pull-up
power supply may cause malfunction and the abnormal current that passes in the device at this time may
cause degradation of internal elements. Input of signals during the power off state must be judged
separately for each device and according to related specifications governing the device.
How to Use This Manual
Readers
This manual is intended for user engineers who wish to understand the functions of the
78K0/Kx2-C and design and develop application systems and programs for these devices.
The target products are as follows.
78K0/KC2-C:
μ
PD78F0760, 78F0761, 78F0762
78K0/KE2-C:
μ
PD78F0763, 78F0764, 78F0765
Purpose
This manual is intended to give users an understanding of the functions described in the
Organization
below.
Organization
The 78K0/Kx2-C manual is separated into two parts:
edition (common to the 78K0 Microcontroller).
this manual and the instructions
78K0/Kx2-C
User’s Manual
(This Manual)
78K/0 Series
User’s Manual
Instructions
Pin functions
Internal block functions
Interrupts
Other on-chip peripheral functions
Electrical specifications
How to Read This Manual
CPU functions
Instruction set
Explanation of each instruction
It is assumed that the readers of this manual have general knowledge of electrical
engineering, logic circuits, and microcontrollers.
To gain a general understanding of functions:
Read this manual in the order of the
CONTENTS.
The mark “<R>” shows major
revised points. The revised points can be easily searched by copying an “<R>” in the
PDF file and specifying it in the “Find what:” field.
How to interpret the register format:
For a bit number enclosed in angle brackets, the bit name is defined as a reserved
word in the RA78K0, and is defined as an sfr variable using the #pragma sfr directive
in the CC78K0.
To know details of the 78K0 Microcontroller instructions:
Refer to the separate document
78K/0 Series Instructions User’s Manual
(U12326E).
Conventions
Data significance:
Note:
Caution:
Remark:
Higher digits on the left and lower digits on the right
Footnote for item marked with
Note
in the text
Information requiring particular attention
Active low representations:
×××
(overscore over pin and signal name)
Supplementary information
...
××××
or
××××B
Numerical representations: Binary
...
××××
Decimal
Hexadecimal
...
××××H
Related Documents
The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
Documents Related to Devices
Document Name
78K0/Kx2-C User’s Manual
78K/0 Series Instructions User’s Manual
78K0 Microcontrollers Self Programming Library Type01 User’s Manual
78K0 Microcontrollers EEPROM
TM
Document No.
This manual
U12326E
U18274E
Note
Emulation Library Type01 User’s Manual
U18275E
Note
This document is classified under engineering management. Contact a Renesas Electronics sales representative.
Documents Related to Development Tools (Software)
Document Name
RA78K0 Ver.3.80 Assembler Package
User’s Manual
Operation
Language
Structured Assembly Language
CC78K0 Ver.3.70 C Compiler
User’s Manual
ID78K0-QB Ver.3.00 Integrated Debugger User’s Manual
PM+ Ver.6.30 User’s Manual
CubeSuite+ V1.00.00 Integrated Development Environment
Note
Document No.
U17199E
U17198E
U17197E
U17201E
U17200E
U18492E
U18416E
Start
78K0 Design
78K0 Coding
78K0 Build
78K0 Debug
Analysis
Message
R20UT0545E
R20UT0546E
R20UT0551E
R20UT0555E
R20UT0559E
R20UT0563E
R20UT0407E
Operation
Language
Operation
Note
Confirm the latest information of CubeSuite+ by referring to the following website.
http://www.renesas.com/cubesuite+
Documents Related to Development Tools (Hardware)
Document Name
QB-MINI2 On-Chip Debug Emulator with Programming Function User’s Manual
QB-78K0KX2C In-Circuit Emulator
Document No.
R20UT0449E
U19841E
Caution The related documents listed above are subject to change without notice. Be sure to use the latest
version of each document when designing.
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参数对比
与UPD78F0765GB-GAH-AX相近的元器件有:UPD78F0760GA-GAM-AX、UPD78F0761GA-GAM-AX、UPD78F0762GA-GAM-AX、UPD78F0764GB-GAH-AX、UPD78F0763GB-GAH-AX。描述及对比如下:
型号 UPD78F0765GB-GAH-AX UPD78F0760GA-GAM-AX UPD78F0761GA-GAM-AX UPD78F0762GA-GAM-AX UPD78F0764GB-GAH-AX UPD78F0763GB-GAH-AX
描述 IC mcu 8bit 60kb flash 64lfqfp IC mcu 8bit 32kb flash 48lfqfp IC mcu 8bit 48kb flash 48lfqfp IC mcu 8bit 60kb flash 48lfqfp IC mcu 8bit 48kb flash 64lfqfp IC mcu 8bit 32kb flash 64lfqfp
Standard Package 1 1 1 1 - -
Category Integrated Circuits (ICs) Integrated Circuits (ICs) Integrated Circuits (ICs) Integrated Circuits (ICs) - -
Family Embedded - Microcontrollers Embedded - Microcontrollers Embedded - Microcontrollers Embedded - Microcontrollers - -
系列
Packaging
Tray Tray Tray Tray - -
Core Process 78K/0 78K/0 78K/0 78K/0 - -
Core Size 8-Bi 8-Bi 8-Bi 8-Bi - -
速度
Speed
20MHz 20MHz 20MHz 20MHz - -
Connectivity 3-Wire SIO, I²C, LIN, UART/USART 3-Wire SIO, I²C, LIN, UART/USART 3-Wire SIO, I²C, LIN, UART/USART 3-Wire SIO, I²C, LIN, UART/USART - -
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT - -
Number of I/O 55 41 41 41 - -
Program Memory Size 60KB (60K x 8) 32KB (32K x 8) 48KB (48K x 8) 60KB (60K x 8) - -
Program Memory Type FLASH FLASH FLASH FLASH - -
RAM Size 3K x 8 1K x 8 2K x 8 3K x 8 - -
Voltage - Supply (Vcc/Vdd) 1.8 V ~ 5.5 V 1.8 V ~ 5.5 V 1.8 V ~ 5.5 V 1.8 V ~ 5.5 V - -
Data Converters A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b - -
Oscillator Type Internal Internal Internal Internal - -
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C - -
封装 / 箱体
Package / Case
64-LQFP 48-LQFP 48-LQFP 48-LQFP - -
Supplier Device Package * * * * - -
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